Major Research Areas
Nanoelectronics and Optoelectronics: Circuits and Systems for Optical Interconnect Applications
As the advancement of device technology has resulted to increase in signal processing speed, metal-based interconnects on printed circuit boards (PCBs) will experience bandwidth limitations due to signal attenuation and distortion, crosstalk, electromagnetic interference, and power dissipation. Optical interconnections have been widely studied as the solution to the electrical interconnect bottleneck and as the potential technology for meeting the high speed and bandwidth requirements of the next generation computer systems. While the mature silicon CMOS (Si-CMOS) technology is well established for high speed information processing, optical systems excel at information transmission. The future and next generation computer and consumer electronic systems are likely to incorporate electronic components communicating along an optical channel that requires optoelectronic devices such as optoelectronic transceivers to convert signals from electrical to optical domain and vice versa. In this project, we will be developing new, more efficient and compact optoelectronic circuits that will facilitate in the miniaturization of optoelectronic systems for optical interconnect applications.
- Enhanced Memristor Model and Neural Encoded ADC Converter Design
- Compact and Low Power Bidirectional Transceiver for Optical Interconnect Applications
- Transceiver Design for Optical Chip-to-chip and Nanophotonics Applications
- Voltage Regulator for Optoelectronic Transceiver and Nanophotonics applications
Nanophotonics: Photonic Computing and Photonic Integrated Circuits
All-optical network of photonic integrated circuits promises a future of stronger, more economical, and more flexible communication, sensing, biophotonic and optical signal processing systems. Silicon photonics use laser light to transfer data among computer chips for what is called “computing at the speed of light”. Optical rays can carry more data and can transfer data faster than electrical semiconductors. In this project, we explore, develop and analyze contemporary circuits and structures that would pave the way towards the realization of all-optical photonic computing systems.
- Dot Product Operator for Photonic and Edge Computing Applications
- Silicon Photonics Based All-optical Logic Gates
- On-Chip Optical Fast Fourier Transforms (OFFTs) for Convolutional Neural Networks (CNN)
- Photonic Integrated Circuit Solutions for Hierarchical Temporal Memory (HTM), Long-Short Term Memory (LSTM) and Spiking Neural Networks (SNN)
- 3D Optical Phased Arrays for UAVs and Driverless Vehicles
- 3D Photonic Integrated Circuits Design
- Silicon Photonics Based Sensors
Modeling and Signal Integrity
Future electronic systems will consist of several significantly heterogeneous modules such as Optoelectronic and analog RF links, mixed-signal analog to digital converters (ADC), digital signal processors (DSP), Central Processor Units (CPU), Memory modules, Micro-fabricated Electro-Mechanical (MEM) resonators, sensors and actuators with power electronics converters. When assembling such heterogeneous set of modules on a single package as in Systems on Package (SoP) structures or integrated circuit substrate as in Systems on Chip (SoC) structures, compatibility issues are seen to arise from many possible perspectives. In this project, we address the physical electromagnetic perspective. We aim to encompass phenomena that range from the well-known electric field capacitive cross-talk, to the more challenging magnetic field inductive coupling, and even full-wave propagating electromagnetic field couplings. We find the standard approach to Electromagnetic Compatibility (EMC) used on Chip-on-Board (CoB), Systems-on Board (SoB) quite inappropriate for Systems on Chip (SoC) where prototyping, metal shielding and ground planes are often expensive, and sometimes completely impractical. We consider such methods such as the use of efficient 3D electromagnetic field solver for analyzing and verifying designs against all sorts of electromagnetic interference before fabrication. Other methods include various modeling techniques for circuit-level, chip-level, board-level and system-level characterization.
- Signal and Crosstalk Analysis Using Optical Convolution of Transmitted Optical Signals
- Optical Convolution: Three-Dimensional Signal Transmission and Crosstalk Analysis in Transmitter-to-Fiber Array Optical Systems
- Equivalent Circuit Model of Memristor Cells for Mixed Signal Applications
- Input/Output Buffer Information Specification (IBIS) Modeling
- Channel Modeling and Optimization
High Bandwidth Packaging Design and Solutions
Terahertz consists of electromagnetic waves at frequencies from 300GHz to 3THz. Some of the significant features of THz wave include high bandwidth, penetration of a variety of materials, traveling in a straight line, as well as being harmless to human body. THz technology finds applications in areas such as in the field of environment/pollution, food inspection, security, in-substance defect observation, bio-diagnostics and communication. This project focuses on the applications for chip-to-chip communication in consumer electronics.
- Wireless Chip-to-chip Interconnects Using the THz band for PCB Applications
- THz Transceiver Design for Chip-to-chip PCB Applications
- High-Bandwidth Package (HBP) Design and Characterization